Description
This high-quality 35g Leaded Solder Paste is formulated with a precise blend of Sn63/Pb37 alloy, flux, and advanced additives for strong, reliable solder joints.
Designed for mobile phone repair, computer servicing, high-precision circuit boards, and SMT/BGA soldering, it offers excellent wetting, smooth flow, and long-lasting adhesion. Ideal for professional and electronic repair use.
Main Features:
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Premium Sn63/Pb37 composition ensures smooth soldering and strong connections
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Low melting point (183°C) for efficient and safe operation
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Excellent wetting and high adhesion for precision soldering
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Ideal viscosity stability — usable up to 48 hours after preparation
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RoHS compliant and suitable for fine electronic and PCB work
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Consistent performance across SMT, BGA, and micro-soldering applications
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Suitable for professional repair environments and electronic workshops
Specifications:
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Material: Sn-Pb alloy (Sn63/Pb37)
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Melting Point: 183°C
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Net Weight: 35g tub
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Certification: RoHS Compliant
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Viscosity Duration: Up to 48 hours
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Operating Temperature: 22–28°C
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Recommended Humidity: RH 30–60%
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Applications: Mobile phone, computer repair, high-precision circuit boards, SMT/BGA soldering