Description
High-quality 80g soldering flux paste designed for precision soldering and electronic repairs.
Perfect for mobile phone, PC card, and chip-level work, it ensures smooth soldering, strong adhesion, and excellent conductivity without corrosion or residue.
Main Features:
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Provides excellent solderability and smooth flow
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Non-corrosive and safe for delicate components
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Strong insulation with neutral pH balance
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Improves solder adhesion and reduces oxidation
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Ideal for mobile phones, PCBs, and microchip repairs
Specifications:
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Net Weight: 80g
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Viscosity: 1 (Pa•S0)
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Granularity: 1 (µm)
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pH Value: Neutral (7.03)
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Type: Rosin-based flux paste
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Applications: Mobile phone, PC card, and electronic chip repair
